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专利名称：Methods for assembling semiconductor
devices in superimposed relation withadhesive material defining the distanceadjacent semiconductor devices are spacedapart from one another
发明人：James M. Derderian申请号：US10987714申请日：20041112公开号：US07335533B2公开日：20080226
专利附图：
摘要：A method for assembling semiconductor devices includes providing a firstsemiconductor device, applying a predetermined volume of adhesive material to at leasta surface of the first semiconductor device, and positioning a second semiconductordevice adjacent to the first semiconductor device in superimposed relation thereto. Theadhesive material may be applied to a surface of the first semiconductor device prior topositioning the second semiconductor device thereover, or introduced between the firstand second semiconductor devices. Upon curing or hardening, the predetermined volumeof adhesive material spaces the first and second semiconductor devices a predetermineddistance apart from one another. Additional semiconductor devices may also be added tothe assembly. The first semiconductor device may be associated with a substrate.
Semiconductor device assemblies and packages that are at least partially fabricated inaccordance with the method are also disclosed.
申请人：James M. Derderian
地址：Boise ID US
国籍：US
代理机构：TraskBritt
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