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专利名称：Method of producing circuit board by
additive method, and circuit board andmultilayer circuit board obtained by themethod
发明人：Yoshioka, Shingo,Fujiwara, Hiroaki申请号：EP13000238.9申请日：20090430公开号：EP2592912A1公开日：20130515
专利附图：
摘要：The present invention relates to a circuit board comprising: a circuit groovehaving at least one land region for surface mounting of electronic parts and at least onecircuit wiring region formed integrally with the land region, and a partial reinforcingstructure formed in the land region of the circuit groove, wherein the partial reinforcingstructure is at least one structure selected from a group consisting of: an irregular shapehaving a ten-point average roughness (Rz) of 0.1 to 20 µm formed on the groove surfacein the land region, a groove shape having the groove depth in the land region larger thanthat of the circuit wiring region to form a plated film having thickness in the land regionthicker than that of the circuit wiring region, and a structure formed by forming at least
one protrusion on the periphery of the groove in the land region.
申请人：Panasonic Corporation
地址：1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
国籍：JP
代理机构：Müller-Boré & Partner Patentanwälte
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