元器件交易网www.cecb2b.com Data sheet acquired from Harris SemiconductorSCHS285A – Revised November 1999The CD54/74AC540, -541, and CD54/74ACT540, -541 octalbuffer/line drivers use the RCA ADVANCED CMOS technology. TheCD54/74AC/ACT540 are inverting 3-state buffers having twoactive-LOW output enables. The CD54/74AC/ACT541 arenon-inverting 3-state buffers having two active-LOW output enables.The CD74AC540, -541, and CD74ACT540, -541 are supplied in20-lead dual-in-line plastic packages (E suffix) and in 20-leaddual-in-line small-outline plastic packages (M suffix). Both packagetypes are operable over the following temperature ranges: Industrial(–40 to +85°C) and Extended Industrial/Military (–55 to +125°C).The CD54AC540, -541, and CD54ACT540, -541, available in chipform (H suffix), are operable over the –55 to +125°C temperaturerange.LHZPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.Copyright © 1999, Texas Instruments IncorporatedPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•1元器件交易网www.cecb2b.com MAXIMUM RATINGS, Absolute-Maximum Values:DC SUPPLY-VOLTAGE (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 to 6 VDC INPUT DIODE CURRENT, IIK (for VI < –0.5 or VI > VCC + 0.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mADC OUTPUT DIODE CURRENT, IOK (for VO < –0.5 or VO > VCC + 0.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mADC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > –0.5 or VO < VCC + 0.5 V). . . . . . . . . . . . . . . . . . . . . . . ±50 mADC VCC OR GROUND CURRENT (ICC or IGND). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA*PACKAGE THERMAL IMPEDANCE, θJA (see Note 1):E package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/WM package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/WSTORAGE TEMPERATURE (Tstg). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to +150°CLEAD TEMPERATURE (DURING SOLDERING):At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265°CUnit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . +300°C* For up to 4 outputs per device: add ±25 mA for each additional output.NOTE 1:The package thermal impedance is calculated in accordance with JESD 51.2POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com POST OFFICE BOX 655303 DALLAS, TEXAS 75265•3元器件交易网www.cecb2b.com 4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网www.cecb2b.com nsPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•5元器件交易网www.cecb2b.com 6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网www.cecb2b.com
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